The Asian Scientist 100
Hei Ming Lai
Institution
The Chinese University of Hong Kong
Country
Hong Kong
Field
Biomedical Sciences
Lai won the 2024 Croucher Tak Wah Mak Innovation Award for leading research in creating a 3D spatial multi-omics platform for clinical diagnostics and spatial biology research.
(Photo: The Chinese University of Hong Kong)
AWARDS
- 2024 Croucher Tak Wah Mak Innovation Award
Related articles
From Idea To Impact
Universities are strongholds of knowledge and ideas, but getting those innovations to the market can be a challenge. Here are four strategies to boost industry-academia collaboration.
Nuts And Bolts—Sink Or Swim With Innovation
Advanced water management systems, diagnostic kits and high-tech floating platforms are now available to the modern-day fish farmer.
Schemes To Help Your Business Grow In 2019
Singaporean companies can tap into a range of government schemes and incentives to help them ride out the uncertainty and thrive in 2019.
Outpacing Disruption With Open Innovation
The Intellectual Property Intermediary (IPI) Singapore provides a suite of resources for local enterprises to access global innovation.
Tapping Into The Global Innovation Marketplace
The Intellectual Property Intermediary Singapore is a gateway to global innovations, helping local and regional enterprises tap on technological solutions for future growth.
Keeping An Open Mind
Open Innovation is not just for large multinational corporations; small and medium enterprises also have a lot to gain.
Co-Creating The Future Of Healthcare
Mr. Sean Carney, Chief Design Officer of Royal Philips, shares his insights into how co-creation drives innovation and creates value in the healthcare sector.
Nuts And Bolts: Giving Sustainability The Green Light
Companies can embrace sustainability by using these TechOffers to increase resource efficiency and recover resources from waste or pollutants.
Nuts And Bolts: Three Thrilling TechOffers From TechInnovation
TechOffers that deliver comfort, convenience and cleverness were on display at TechInnovation 2017.









